Press release; Adam Connors, DigiTimes.com [Thursday 11 April 2002]
Micron Technology announced on April 8 the availability of samples of its PC2700 TSOP (thin small outline package) DIMM (dual in-line memory module) utilizing DDR333 SDRAM, following validation of Silicon Integrated Systems (SiS) SiS S551 motherboards using the revised modules and positive results from VIA tests with the KT333 chipset.
The company claims the samples to be an industry first in its adherence to newly revised Joint Electron Device Engineering Council (JEDEC) standards, in which stub resistors are added on the addressing/command lines of the module for improved signal integrity at high frequencies.
Remarks by SiS and VIA representatives pointed to the flawless execution of the new products. The new modules will be available in a wide range of densities and configurations, the statement said.
VIA achieves full validation for vendors’ DDR333 chipset modules (Apr 9)
Apacer and IBM cooperate to promote PC2100 DDR (Jan 18, 2001)