Compiled from outside sources; Adam Connors, DigiTimes.com [Friday 12 April 2002]
Elpida, the wafer manufacture joint venture between Japanese heavyweights Hitachi and NEC, is considering moving its 12-inch fab currently under construction to Taiwan, possibly teaming up with Taiwan-based Powerchip Semiconductor (PSC), said the Economic Daily News Chinese-language newspaper. Elpida reportedly was motivated by its need to increase competitiveness.
PSC, the report said, refused to comment on the possibility of a tie-up.
Taiwanese chipmaker PSC recently moved into the 12-inch field with installations in its first of two planned fabs on March 25. Trial production of 0.13-micron processed wafers is expected by mid-year, with monthly volume production of 15,000 wafers expected by year-end.
Related stories:
DRAM demand to drive 12-inch production (Mar 26)
PSC installs 12-inch back-end SACVD equipment (Mar 26)
Little profits for DRAM makers, Elpida turning to non-PC DRAM production (Nov 2)
