Combined from outside sources; Adam Connors, DigiTimes.com [Wednesday 27 March 2002]
Grace Semiconductor Manufacturing Corporation (GSMC), scheduled to start operation of its first 8-inch fab based in Shanghai’s Zhangjiang Hi-Tech Park in 2003, and ChipPAC, China’s largest end-to-end semiconductor packaging and service foreign investor and manufacturer, announced on March 26 a non-exclusive alliance in preparation for GSMC’s plant coming online.
Continue reading “GSMC, ChipPAC combine for end-to-end assembly and testing”
