Compiled from outside sources; Adam Connors, DigiTimes.com [Monday 8 April 2002]
The process for sub-0.10-micron thin-film, low-resistance (k) material production, stalled under the burden of bad market conditions and slow manufacturing technology advancement, is beginning to achieve acceptance due to a group of key decisions and announcements this past week.
Continue reading “Low-k dielectrics to get push by Dow Chemical, US, Taiwan and Japan”
